The Nature of Intrinsic Stresses in Thin Copper Condensates Deposited on Solid State Substrates

Publisher: Trans Tech Publications

E-ISSN: 1661-9897|2018|54|66-74

ISSN: 1662-5250

Source: Journal of Nano Research, Vol.2018, Iss.54, 2018-10, pp. : 66-74

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Abstract