A high reliability module with thermoelectric device by molding technology for M2M wireless sensor network

Author： Nakagawa K   Tanaka T   Suzuki T  

Publisher： IOP Publishing

E-ISSN： 1361-6439|25|10|104012-104019

ISSN： 0960-1317

Source： Journal of Micromechanics and Microengineering, Vol.25, Iss.10, 2015-10, pp. : 104012-104019

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