Development of a large-area chip network with multidevice integration using a stretchable electroplated copper spring

Author: Sung Wei-Lun   Chen Chih-Chung   Huang Kevin   Fang Weileun  

Publisher: IOP Publishing

E-ISSN: 1361-6439|26|2|25003-25017

ISSN: 0960-1317

Source: Journal of Micromechanics and Microengineering, Vol.26, Iss.2, 2016-02, pp. : 25003-25017

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