Effects of ball bond diameter on wire bond reliability for automotive application

Author: Peng Hui Yuen   Devarajan Mutharasu   Lee Teik Toon   Lacey David  

Publisher: Emerald Group Publishing Ltd

E-ISSN: 1758-812X|33|1|53-60

ISSN: 1356-5362

Source: Microelectronics International, Vol.33, Iss.1, 2016-01, pp. : 53-60

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Abstract