Aluminum bond-wire properties after 1 billion mechanical cycles

Author： Lefranc G.   Weiss B.   Klos C.   Dick J.   Khatibi G.   Berg H.  

Publisher： Elsevier

ISSN： 0026-2714

Source： Microelectronics Reliability, Vol.43, Iss.9, 2003-09, pp. : 1833-1838

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