Ferromagnetism in Fe-doped CuO nanopowder

By Jing Zhao   Qinglin Xia   Jinmin Li  

Journal of Semiconductors, Vol. 33, Iss. 1, 2012-01 ,pp. : 13001-13003

IOP Publishing

Access to resources Recommend Favorite

Enhancing the Stability of CuO Thin-Film Photoelectrodes by Ti Alloying

By Tang Houwen  

Journal of Electronic Materials, Vol. 41, Iss. 11, 2012-11 ,pp. : 3062-3067

Springer Publishing Company

Access to resources Recommend Favorite

Barrier layers for Cu ULSI metallization

By Shacham-Diamand Yosi  

Journal of Electronic Materials, Vol. 30, Iss. 4, 2001-04 ,pp. : 336-344

Springer Publishing Company

Access to resources Recommend Favorite

Removal of residual CuO particles on the post CMP wafer surface of multi-layered copper

By Yan Li   Ming Sun   Xinhuan Niu   Yuling Liu   Yangang He   Hailong Li   Aochen Wang   Hongbo Li  

Journal of Semiconductors, Vol. 35, Iss. 4, 2014-04 ,pp. : 46001-46008

IOP Publishing

Access to resources Recommend Favorite

Field electron emission from structure-controlled one-dimensional CuO arrays synthesized by wet chemical process

By Liqin Hu   Dian Zhang   Hailong Hu   Tailiang Guo  

Journal of Semiconductors, Vol. 35, Iss. 7, 2014-07 ,pp. : 73003-73006

IOP Publishing

Access to resources Recommend Favorite