Publisher: Trans Tech Publications
E-ISSN: 1662-9752|2016|858|535-539
ISSN: 0255-5476
Source: Materials Science Forum, Vol.2016, Iss.858, 2016-06, pp. : 535-539
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
Elimination of Basal Plane Dislocations in Epitaxial 4H-SiC via Multicycle Rapid Thermal Annealing
Materials Science Forum, Vol. 2015, Iss. 821, 2015-07 ,pp. :
Warpage Structure of 4H-SiC after Implantation and Annealing Processes
Materials Science Forum, Vol. 2016, Iss. 858, 2016-06 ,pp. :