Sub-pixel image correlation: an alternative to SAM and dye penetrant for crack detection and mechanical stress localisation in semiconductor packages

Author： Goh J.Y.L. Pitter M.C. See C.W. Somekh M.G. Vanderstraeten D.

Publisher： Elsevier

ISSN： 0026-2714

Source： Microelectronics Reliability, Vol.44, Iss.2, 2004-02, pp. : 259-267

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