Enhanced adhesion of copper to dielectrics via titanium and chromium additions and sacrificial reactions

Author： Russell S.W.   Rafalski S.A.   Spreitzer R.L.   Li J.   Alford T.L.   Moinpour M.   Moghadam F.  

Publisher： Elsevier

ISSN： 0040-6090

Source： Thin Solid Films, Vol.262, Iss.1, 1995-06, pp. : 154-167

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