Diffusion of copper through dielectric films under bias temperature stress

Author： Raghavan G.   Chiang C.   Anders P.B.   Tzeng S.-M.   Villasol R.   Bai G.   Fraser D.B.   Bohr M.  

Publisher： Elsevier

ISSN： 0040-6090

Source： Thin Solid Films, Vol.262, Iss.1, 1995-06, pp. : 168-176

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