Integration of copper multilevel interconnects with oxide and polymer interlevel dielectrics

Author: Gutmann R.J.   Chow T.P.   Lakshminarayanan S.   Price D.T.   Steigerwald J.M.   Murarka S.P.   You L.  

Publisher: Elsevier

ISSN: 0040-6090

Source: Thin Solid Films, Vol.270, Iss.1, 1995-12, pp. : 472-479

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Abstract