Chemical-mechanical polishing of copper with oxide and polymer interlevel dielectrics

By Gutmann R.J.   Steigerwald J.M.   You L.   Price D.T.   Neirynck J.   Murarka S.P.   Duquette D.J.  

Thin Solid Films, Vol. 270, Iss. 1, 1995-12 ,pp. : 596-600

Elsevier

Access to resources Recommend Favorite

Study of the material properties and suitability of plasma-deposited fluorine-doped silicon dioxides for low dielectric constant interlevel dielectrics

By Shannon V.L.   Karim M.Z.  

Thin Solid Films, Vol. 270, Iss. 1, 1995-12 ,pp. : 498-502

Elsevier

Access to resources Recommend Favorite

Process technology and integration challenges for high performance interconnects

By Sandhu G.S.  

Thin Solid Films, Vol. 320, Iss. 1, 1998-05 ,pp. : 1-9

Elsevier

Access to resources Recommend Favorite

Nanorecycling: Monolithic Integration of Copper and Copper Oxide Nanowire Network Electrode through Selective Reversible Photothermochemical Reduction

By  

ADVANCED MATERIALS, Vol. 27, Iss. 41, 2015-11 ,pp. : 6397-6403

John Wiley & Sons Inc

Access to resources Recommend Favorite

Electrical stability of polyimide siloxane films for interlayer dielectrics in multilevel interconnections

By Homma T.   Yamaguchi M.   Kutsuzawa Y.   Otsuka N.  

Thin Solid Films, Vol. 340, Iss. 1, 1999-02 ,pp. : 237-241

Elsevier

Access to resources Recommend Favorite