The effect of the polishing pad treatments on the chemical-mechanical polishing of SiO 2 films

Author: Li W.   Shin D.W.   Tomozawa M.   Murarka S.P.  

Publisher: Elsevier

ISSN: 0040-6090

Source: Thin Solid Films, Vol.270, Iss.1, 1995-12, pp. : 601-606

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract