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Thin Solid Films, Vol. 437, Iss. 1, 2003-08 ,pp. : 248-256

Elsevier

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A comparative study of sputtered TaC x and WC x films as diffusion barriers between Cu and Si

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Self-diffusion of aluminium in the intermetallic compound Fe-48 at.% Al

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Philosophical Magazine, Vol. 83, Iss. 4, 2003-02 ,pp. : 477-483

Taylor & Francis Ltd

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Applicability of ALE TiN films as Cu/Si diffusion barriers

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Electrochemical preparation of In and Al doped ZnO thin films for CuInSe 2 solar cells

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