A comparative study of sputtered TaC x and WC x films as diffusion barriers between Cu and Si

Author: Wang S.J.   Tsai H.Y.   Sun S.C.  

Publisher: Elsevier

ISSN: 0040-6090

Source: Thin Solid Films, Vol.394, Iss.1, 2001-08, pp. : 179-187

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Abstract