Structure and thermal stability of graded Ta-TaN diffusion barriers between Cu and SiO 2

Author: Hubner R.   Hecker M.   Mattern N.   Hoffmann V.   Wetzig K.   Wenger C.   Engelmann H.-J.   Wenzel C.   Zschech E.   Bartha J.W.  

Publisher: Elsevier

ISSN: 0040-6090

Source: Thin Solid Films, Vol.437, Iss.1, 2003-08, pp. : 248-256

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Abstract