WN x diffusion barriers between Si and Cu

Author: Murakami M.   Uekubo M.   Oku T.   Nii K.   Takahiro K.   Yamaguchi S.   Ohta T.   Nakano T.  

Publisher: Elsevier

ISSN: 0040-6090

Source: Thin Solid Films, Vol.286, Iss.1, 1996-09, pp. : 170-175

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Abstract