Deposition mechanism of MOCVD copper films in the presence of water vapor

Author: Kim J.-Y.   Lee Y.-K.   Park H.-S.   Park J.-W.   Park D.-K.   Joo J.-H.   Lee W.-H.   Ko Y.-K.   Reucroft P.J.   Cho B.-R.  

Publisher: Elsevier

ISSN: 0040-6090

Source: Thin Solid Films, Vol.330, Iss.2, 1998-09, pp. : 190-195

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Abstract