Selective chemical vapor deposition of copper using (hfac) copper(I) vinyltrimethylsilane in the absence and presence of water

Author: Gelatos A.V.   Mogab C.J.   Marsh R.   Kodas E.T.T.   Jain A.   Hampden-Smith M.J.  

Publisher: Elsevier

ISSN: 0040-6090

Source: Thin Solid Films, Vol.262, Iss.1, 1995-06, pp. : 52-59

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract