Thermal stability of AlSiCu/W/n + p diodes with and without TiN barrier layer

By Yeh W.-K.   Chen M.-C.   Wang P.-J.   Liu L.-M.   Lin M.-S.  

Thin Solid Films, Vol. 270, Iss. 1, 1995-12 ,pp. : 526-530

Elsevier

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Characteristics of TiN barrier layer against Cu diffusion

By Kwak M.Y.   Shin D.H.   Kang T.W.   Kim K.N.  

Thin Solid Films, Vol. 339, Iss. 1, 1999-02 ,pp. : 290-293

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Interfacial reactions of rf-sputtered TiNi thin films on (100) silicon with a SiN diffusion barrier

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Philosophical Magazine, Vol. 84, Iss. 12, 2004-04 ,pp. : 1209-1218

Taylor & Francis Ltd

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Correlation between microstructure and barrier properties of TiN thin films used Cu interconnects

By Moriyama M.   Kawazoe T.   Tanaka M.   Murakami M.  

Thin Solid Films, Vol. 416, Iss. 1, 2002-09 ,pp. : 136-144

Elsevier

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Thermal stability of Al/barrier/TiSi x multilayer structures

By Lu J.P.   Hsu W.Y.   Hong Q.Z.   Dixit G.A.   Luttmer J.D.   Havemann R.H.   Chen P.J.   Tsai H.L.   Magel L.K.  

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