Effects of hydrogen plasma pretreatment on characteristics of copper film deposited by remote plasma CVD using (hfac)Cu(TMVS)

Author： Lee J.-H.   Lee J.-H.   Hwang K.-J.   Kim J.-Y.   Suk C.-G.   Choi S.-Y.  

Publisher： Elsevier

ISSN： 0040-6090

Source： Thin Solid Films, Vol.375, Iss.1, 2000-10, pp. : 132-136

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