A novel process and thermodynamic mechanisms of air gap formation for ULSI application

Author: Chang K.-M.   Yang J.-Y.   Chen L.-W.   Hau Tseng M.  

Publisher: Elsevier

ISSN: 0040-6090

Source: Thin Solid Films, Vol.376, Iss.1, 2000-11, pp. : 124-130

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Abstract