The effect of low dielectric polymer thickness on the electromigration characteristics of Al(1% Cu-0.5% Si) thin films

Author： Yoo S. Eun B.S. Kim Y.-H. Chung Y.-C.

Publisher： Elsevier

ISSN： 0040-6090

Source： Thin Solid Films, Vol.382, Iss.1, 2001-02, pp. : 222-229

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