Thin film microstructure and thermal transport simulation using 3D-films

Author: Smy T.   Walkey D.   Harris K.D.   Brett M.J.  

Publisher: Elsevier

ISSN: 0040-6090

Source: Thin Solid Films, Vol.391, Iss.1, 2001-07, pp. : 88-100

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract