Ion solid surface interactions in ionized copper physical vapor deposition

Author: Liu X.-Y.   Daw M.S.   Kress J.D.   Hanson D.E.   Arunachalam V.   Coronell D.G.   Liu C.-L.   Voter A.F.  

Publisher: Elsevier

ISSN: 0040-6090

Source: Thin Solid Films, Vol.422, Iss.1, 2002-12, pp. : 141-149

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Abstract