Author: Brendel K. Nickel N.H. Lengsfeld P. Schopke A. Sieber I. Nerding M. Strunk H.P. Fuhs W.
Publisher: Elsevier
ISSN: 0040-6090
Source: Thin Solid Films, Vol.427, Iss.1, 2003-03, pp. : 86-90
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Abstract
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