A new indentation cracking method for evaluating interfacial adhesion energy of hard films

Author： Kim J.-j.   Jeong J.-h.   Lee K.-R.   Kwon D.  

Publisher： Elsevier

ISSN： 0040-6090

Source： Thin Solid Films, Vol.441, Iss.1, 2003-09, pp. : 172-179

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