Featured issue: Lead-free solder and packaging

ISSN： 0957-4522

Source： Journal of Materials Science: Materials in Electronics, Vol.23, Iss.1, 2012-01, pp. : 1-1

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content

Thermodynamics and phase diagrams of lead-free solder materials

By Ipser H. Flandorfer H. Luef Ch. Schmetterer C. Saeed U.

Journal of Materials Science: Materials in Electronics, Vol. 18, Iss. 1-3, 2007-03 ,pp. : 3-17

Springer Publishing Company

Access to resources Recommend Favorite

Electromigration issues in lead-free solder joints

By Chen Chih Liang S.

Journal of Materials Science: Materials in Electronics, Vol. 18, Iss. 1-3, 2007-03 ,pp. : 259-268

Springer Publishing Company

Access to resources Recommend Favorite

Liquidus and Wettablity of Lead-Free Solder Alloys

Advanced Materials Research, Vol. 2015, Iss. 1120, 2015-08 ,pp. : 462-465

Trans Tech Publications

Access to resources Recommend Favorite

Reliability of printed circuit boards containing lead-free solder in aggressive environments

By Moshrefi-Torbati M. Swingler J.

Journal of Materials Science: Materials in Electronics, Vol. 22, Iss. 4, 2011-04 ,pp. : 400-411

Springer Publishing Company

Access to resources Recommend Favorite

Room-temperature indentation creep of lead-free Sn–Bi solder alloys

By Mahmudi R. Geranmayeh A. Mahmoodi S. Khalatbari A.

Journal of Materials Science: Materials in Electronics, Vol. 18, Iss. 10, 2007-10 ,pp. : 1071-1078

Springer Publishing Company

Access to resources Recommend Favorite