Effects of rare earth additions on the microstructural evolution and microhardness of Sn30Bi0.5Cu and Sn35Bi1Ag solder alloys

By Shen Jun  

Journal of Materials Science: Materials in Electronics, Vol. 23, Iss. 1, 2012-01 ,pp. : 156-163

Springer Publishing Company

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Effects of trace rare earth Nd addition on microstructure and properties of SnAgCu solder

By Gao Lili   Xue Songbai   Zhang Liang   Sheng Zhong   Zeng Guang   Ji Feng  

Journal of Materials Science: Materials in Electronics, Vol. 21, Iss. 7, 2010-07 ,pp. : 643-648

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Effect of adding Ce on interfacial reactions between Sn–Ag solder and Cu

By Yoon Jeong-Won   Noh Bo-In   Choi Jung-Hyun   Jung Seung-Boo  

Journal of Materials Science: Materials in Electronics, Vol. 22, Iss. 7, 2011-07 ,pp. : 745-750

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Influence of minor Ag nano-particles additions on the microstructure of Sn30Bi0.5Cu solder reacted with a Cu substrate

By Peng Changfei   Shen Jun   Xie Weidong   Chen Jie   Wu Cuiping   Wang Xiaochuan  

Journal of Materials Science: Materials in Electronics, Vol. 22, Iss. 7, 2011-07 ,pp. : 797-806

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Correlation between interfacial microstructure and shear behavior of Sn–Ag–Cu solder ball joined with Sn–Zn–Bi paste

By Shih Po-Cheng   Lin Kwang-Lung  

Journal of Materials Science, Vol. 42, Iss. 8, 2007-04 ,pp. : 2574-2581

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