A Reliability Statistics Perspective on the Pitfalls of Standard Wafer-Level Electromigration Accelerated Test (SWEAT)

ISSN： 0923-8174

Source： Journal of Electronic Testing, Vol.17, Iss.1, 2001-02, pp. : 63-68

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content

Thermomechanical Reliability Study of Benzocyclobutene Film in Wafer-Level Chip-Size Package

By Lee K.-O.

Journal of Electronic Materials, Vol. 41, Iss. 4, 2012-04 ,pp. : 706-711

Springer Publishing Company

Access to resources Recommend Favorite

Issues in accelerated electromigration of solder bumps

By Rinne G.A.

Microelectronics Reliability, Vol. 43, Iss. 12, 2003-12 ,pp. : 1975-1980

Elsevier

Access to resources Recommend Favorite

High-Q RF inductors on 20 Ω.cm silicon realized through wafer-level packaging techniques

By Carchon G.J. Raedt W De Beyne E

Microelectronics International, Vol. 20, Iss. 1, 2003-01 ,pp. : 26-30

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Selective bonding and encapsulation for wafer-level vacuum packaging of MEMS and related micro systems

By Tao Y. Malshe A.P. Brown W.D.

Microelectronics Reliability, Vol. 44, Iss. 2, 2004-02 ,pp. : 251-258

Elsevier

Access to resources Recommend Favorite

Discussion on the Mechanism of Electromigration from the Perspective of Electromagnetism

By Zhou Peng

Journal of Electronic Materials, Vol. 39, Iss. 12, 2010-12 ,pp. : 2583-2587

Springer Publishing Company

Access to resources Recommend Favorite