Author: Rencz M.
Publisher: Elsevier
ISSN: 0026-2692
Source: Microelectronics, Vol.34, Iss.12, 2003-12, pp. : 1113-1114
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
Thermal macromodelling of integrated circuits
International Journal of Electronics, Vol. 87, Iss. 8, 2000-08 ,pp. :
Thermal Testing of Analogue Integrated Circuits: A Case Study
By Altet J.
Journal of Electronic Testing, Vol. 19, Iss. 3, 2003-06 ,pp. :
By Makri R. Uzunoglu N.K. Gargalakos M.
Active and Passive Electronic Components, Vol. 25, Iss. 1, 2002-01 ,pp. :
By Joshi Y. Azar K. Blackburn D. Lasance C.J.M. Mahajan R. Rantala J.
Microelectronics, Vol. 34, Iss. 12, 2003-12 ,pp. :