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Author: Kuo H. Kuo J. Wang Y. Lin C. Chen H. Stillman G.
Publisher: Springer Publishing Company
ISSN: 1543-186X
Source: Journal of Electronic Materials, Vol.26, Iss.8, 1997-08, pp. : 944-948
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
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