Effects of Co Alloying and Size on Solidification and Interfacial Reactions in Sn-57 wt.%Bi-(Co)/Cu Couples

By Huang Yu-chih  

Journal of Electronic Materials, Vol. 40, Iss. 1, 2011-01 ,pp. : 62-70

Springer Publishing Company

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Interfacial Reactions in Sn-Co-(Cu)/Ni Couples With/Without Current Stressing

By Chen Chih-ming  

Journal of Electronic Materials, Vol. 41, Iss. 11, 2012-11 ,pp. : 3205-3214

Springer Publishing Company

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Study of the Effects of Zn Content on the Interfacial Reactions Between Sn-Zn Solders and Ni Substrates at 250°C

By Wang Chao-hong  

Journal of Electronic Materials, Vol. 39, Iss. 11, 2010-11 ,pp. : 2375-2381

Springer Publishing Company

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Co Solubility in Sn and Interfacial Reactions in Sn-Co/Ni Couples

By Chen Sinn-wen  

Journal of Electronic Materials, Vol. 39, Iss. 11, 2010-11 ,pp. : 2418-2428

Springer Publishing Company

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Effects of Minor Ni Doping on Microstructural Variations and Interfacial Reactions in Cu/Sn-3.0Ag-0.5Cu- x Ni/Au/Ni Sandwich Structures

By Yu Chi-Yang  

Journal of Electronic Materials, Vol. 39, Iss. 12, 2010-12 ,pp. : 2544-2552

Springer Publishing Company

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