Comparative study of the dissolution kinetics of electrolytic Ni and electroless Ni-P by the molten Sn3.5Ag0.5Cu solder alloy

Author： Islam M.N. Chan Y.C. Sharif A. Alam M.O.

Publisher： Elsevier

ISSN： 0026-2714

Source： Microelectronics Reliability, Vol.43, Iss.12, 2003-12, pp. : 2031-2037

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