Phase Equilibria in the Sn-Ni-Zn Ternary System: Isothermal Sections at 200°C, 500°C, and 800°C

By Chang Jaewon  

Journal of Electronic Materials, Vol. 39, Iss. 12, 2010-12 ,pp. : 2643-2652

Springer Publishing Company

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Study of the Effects of Zn Content on the Interfacial Reactions Between Sn-Zn Solders and Ni Substrates at 250°C

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Journal of Electronic Materials, Vol. 39, Iss. 11, 2010-11 ,pp. : 2375-2381

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Au−Ni−Sn intermetallic phase relationships in eutectic Pb−Sn solder formed on Ni/Au metallization

By Song H.   Ahn J.   Minor A.   Morris J.  

Journal of Electronic Materials, Vol. 30, Iss. 4, 2001-04 ,pp. : 409-414

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Interfacial Reactions of Sn-58Bi and Sn-9Zn Lead-Free Solders with Au/Ni/SUS304 Multilayer Substrate

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Journal of Electronic Materials, Vol. 39, Iss. 11, 2010-11 ,pp. : 2412-2417

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Effects of Zn-Containing Flux on Sn-3.5Ag Soldering with an Electroless Ni-P/Au Surface Finish: Microstructure and Wettability

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Journal of Electronic Materials, Vol. 39, Iss. 12, 2010-12 ,pp. : 2598-2604

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