Influence of Palladium Thickness on the Soldering Reactions Between Sn-3Ag-0.5Cu and Au/Pd(P)/Ni(P) Surface Finish

By Wu W.  

Journal of Electronic Materials, Vol. 39, Iss. 11, 2010-11 ,pp. : 2387-2396

Springer Publishing Company

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Reactions of Sn-3.5Ag-Based Solders Containing Zn and Al Additions on Cu and Ni(P) Substrates

By Kotadia H.  

Journal of Electronic Materials, Vol. 39, Iss. 12, 2010-12 ,pp. : 2720-2731

Springer Publishing Company

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Interdependent Intermetallic Compound Growth in an Electroless Ni-P/Sn-3.5Ag Reaction Couple

By Kumar Aditya  

Journal of Electronic Materials, Vol. 40, Iss. 2, 2011-02 ,pp. : 213-223

Springer Publishing Company

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Comparative study of the dissolution kinetics of electrolytic Ni and electroless Ni-P by the molten Sn3.5Ag0.5Cu solder alloy

By Islam M.N.   Chan Y.C.   Sharif A.   Alam M.O.  

Microelectronics Reliability, Vol. 43, Iss. 12, 2003-12 ,pp. : 2031-2037

Elsevier

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Effect of Pd Thickness on the Interfacial Reaction and Shear Strength in Solder Joints Between Sn-3.0Ag-0.5Cu Solder and Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Surface Finish

By Kim Young  

Journal of Electronic Materials, Vol. 41, Iss. 4, 2012-04 ,pp. : 763-773

Springer Publishing Company

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