Modeling and characterization of three kinds of MEMS resonators fabricated with a thick polysilicon technology

Author： Paci D.   Mastrangeli M.   Nannini A.   Pieri F.  

Publisher： Springer Publishing Company

ISSN： 0925-1030

Source： Analog Integrated Circuits and Signal Processing, Vol.48, Iss.1, 2006-08, pp. : 41-47

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content

Thermoelectric energy harvester fabricated in thick-film/LTCC technology

By Markowski Piotr  

Microelectronics International, Vol. 31, Iss. 3, 2014-07 ,pp. : 176-185

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Electro-thermal Stimuli for MEMS Testing in FSBM Technology

By Dumas N.   Azaïs F.   Latorre L.   Nouet P.  

Journal of Electronic Testing, Vol. 22, Iss. 2, 2006-04 ,pp. : 189-198

Springer Publishing Company

Access to resources Recommend Favorite

Modeling and simulation of NTC thick film thermistor geometries

By Aleksic O.S.   Radojcic B.M.   Ramovic R.M.  

Microelectronics International, Vol. 24, Iss. 1, 2007-01 ,pp. : 27-34

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Advanced Thick-film Technology - The New Generation*

By Barnwell P   Wood J  

Microelectronics International, Vol. 14, Iss. 3, 1997-03 ,pp. : 51-53

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Interconnection Technology for Advanced High Density Thick Films*

By M.Vrana   Calster A.Van   Berghe** R.Vanden   K.Allaert**  

Microelectronics International, Vol. 13, Iss. 3, 1996-03 ,pp. : 5-8

Emerald Group Publishing Ltd

Access to resources Recommend Favorite