Optimization of liquid cooling fins in microelectronic packaging

Author: T. Ng N.   W. Lai K.   A. Quadir G.   N. Seetharamu K.   Azid I. Abdul   A. Zainal Z.  

Publisher: Taylor & Francis Ltd

ISSN: 0305-215X

Source: Engineering Optimization, Vol.35, Iss.4, 2003-08, pp. : 359-374

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Abstract