Effect of volume in interfacial reaction between eutectic Sn-Pb solder and Cu metallization in microelectronic packaging

Author： Sharif A.   Chan Y.C.   Islam R.A.  

Publisher： Elsevier

ISSN： 0921-5107

Source： Materials Science and Engineering: B, Vol.106, Iss.2, 2004-01, pp. : 120-125

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