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International Journal of Electronics, Vol. 87, Iss. 10, 2000-10 ,pp. : 1257-1268

Taylor & Francis Ltd

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Finite-Element Analysis of Current-Induced Thermal Stress in a Conducting Sphere

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Interpolation of numerically computed potential using finite element approach

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Microelectronics International, Vol. 21, Iss. 1, 2004-01 ,pp. : 28-30

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Studying electro-physical material characteristics of vacuum-deposited layers of aluminium (tantalum) when using aluminium sheet as a carrier for MCM, interconnections, vias and resistive groups

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Finite element analysis of thermal distributions of solder ball in flip chip ball grid array using ABAQUS

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