Improved adhesion between plasma-treated polyimide film and evaporated copper

By Inagaki N.   Tasaka S.   Hibi K.  

Journal of Adhesion Science and Technology, Vol. 8, Iss. 4, 1994-01 ,pp. : 395-410

Taylor & Francis Ltd

Access to resources Recommend Favorite

Adhesion interaction between electrolessly deposited copper film and polyimide

By Vorobyova T.N.  

Journal of Adhesion Science and Technology, Vol. 11, Iss. 2, 1997-01 ,pp. : 167-182

Taylor & Francis Ltd

Access to resources Recommend Favorite

Adhesion and interface investigation of polyimide on metals

By Kim Y.-H.  

Journal of Adhesion Science and Technology, Vol. 2, Iss. 1, 1988-01 ,pp. : 95-105

Taylor & Francis Ltd

Access to resources Recommend Favorite

Improvement in the adhesion between copper metal and polyimide substrate by plasma polymer deposition of cyano compounds onto polyimide

By Inagaki N.   Tasaka S.   Ohmori H.   Mibu S.  

Journal of Adhesion Science and Technology, Vol. 10, Iss. 3, 1996-01 ,pp. : 243-256

Taylor & Francis Ltd

Access to resources Recommend Favorite

Changes in the adhesion strength between copper thin films and polyimide substrates after heat treatment

By Iwamori Satoru   Miyashita Takehiro   Fukuda Shin   Nozaki Shouhei   Sudoh Kazufuyu   Fukuda Nobuhiro  

Journal of Adhesion Science and Technology, Vol. 11, Iss. 6, 1997-01 ,pp. : 783-795

Taylor & Francis Ltd

Access to resources Recommend Favorite