Evaluation of Thermal and Hygro-Thermal Behaviors of Flip Chip Packages With a Non-conductive Paste
Author： Noh Bo-In
Publisher： Taylor & Francis Ltd
ISSN： 1568-5616
Source： Journal of Adhesion Science and Technology, Vol.22, Iss.13, 2008-09, pp. : 1355-1364
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
Access to resources
Recommend
