Adhesion enhancement of polyimide on copper by Ar ion beam etching of copper

By Paik Kyung W.   Ruoff Arthur L.  

Journal of Adhesion Science and Technology, Vol. 2, Iss. 1, 1988-01 ,pp. : 245-253

Taylor & Francis Ltd

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An XPS study of argon ion beam and oxygen RIE modified BPDA-PDA polyimide as related to adhesion

By Flitsch Richard  

Journal of Adhesion Science and Technology, Vol. 10, Iss. 12, 1996-01 ,pp. : 1241-1253

Taylor & Francis Ltd

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Adhesion Properties and Structure of Ion-Beam Modified Polyimide Films

By Kim Youn J.  

Journal of Adhesion Science and Technology, Vol. 25, Iss. 9, 2011-03 ,pp. : 993-1000

Taylor & Francis Ltd

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Adhesion enhancement of magnetron-sputtered copper films by ion bombardment etching treatment of nickel and Inconel substrates: investigations by Auger electron spectroscopy and secondary ion mass spectroscopy of the ion beam effects

By Cahoreau M.  

Journal of Adhesion Science and Technology, Vol. 5, Iss. 11, 1991-01 ,pp. : 987-999

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Adhesion strength of copper thin-films to a E24 carbon steel: effects of substrate surface ion bombardment etching

By Cailler M.  

Journal of Adhesion Science and Technology, Vol. 7, Iss. 2, 1993-01 ,pp. : 141-157

Taylor & Francis Ltd

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