Adhesion strength of copper thin-films to a E24 carbon steel: effects of substrate surface ion bombardment etching

By Cailler M.  

Journal of Adhesion Science and Technology, Vol. 7, Iss. 2, 1993-01 ,pp. : 141-157

Taylor & Francis Ltd

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Adhesion enhancement of magnetron-sputtered copper films by ion bombardment etching treatment of nickel and Inconel substrates: investigations by Auger electron spectroscopy and secondary ion mass spectroscopy of the ion beam effects

By Cahoreau M.  

Journal of Adhesion Science and Technology, Vol. 5, Iss. 11, 1991-01 ,pp. : 987-999

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Adhesion studies of radio-frequency sputtered AIN films on XC 70 steel substrates. Effect of ageing treatment after deposition

By Lahmar A.  

Journal of Adhesion Science and Technology, Vol. 8, Iss. 9, 1994-01 ,pp. : 981-993

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Cracking and loss of adhesion of Si3N4 and SiO2:P films deposited on Al substrates

By Scafidi P.   Ignat M.  

Journal of Adhesion Science and Technology, Vol. 12, Iss. 11, 1998-01 ,pp. : 1219-1242

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Effects of substrate bias voltage on adhesion of DC magnetron-sputtered copper films on E24 carbon steel: investigations by Auger electron spectroscopy

By Ouis Abousoufiane   Cailler Michel  

Journal of Adhesion Science and Technology, Vol. 27, Iss. 21, 2013-11 ,pp. : 2367-2386

Taylor & Francis Ltd

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