Aqueous pretreatments of polyetherimide to facilitate the bonding of electrolessly deposited copper

By Karas Bradley R.   Foust Donald F.   Dumas William V.   Lamby Edward J.  

Journal of Adhesion Science and Technology, Vol. 6, Iss. 7, 1992-01 ,pp. : 815-828

Taylor & Francis Ltd

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Development and thermal durability of an interfacial bond between electrolessly deposited metals and a fluorinated polyimide

By Baumgartner Charles E.   Scott Lisa Renee  

Journal of Adhesion Science and Technology, Vol. 9, Iss. 7, 1995-01 ,pp. : 789-799

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Adhesion of electrolessly-deposited copper to photosensitive epoxy

By Ge J.   Tuominen R.   Kivilahti J. K.  

Journal of Adhesion Science and Technology, Vol. 15, Iss. 10, 2001-10 ,pp. : 1133-1143

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Adhesion of electrolessly deposited Ni(P) on alumina ceramic: An assessment of the current status

By Severin J.W.   De With G.  

Journal of Adhesion Science and Technology, Vol. 7, Iss. 2, 1993-01 ,pp. : 115-130

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Adhesion interaction between electrolessly deposited copper film and polyimide

By Vorobyova T.N.  

Journal of Adhesion Science and Technology, Vol. 11, Iss. 2, 1997-01 ,pp. : 167-182

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