Aqueous pretreatment of polyetherimide to facilitate the bonding of electrolessly deposited metals. Part 2. Solubilizer-free systems

By Karas Bradley R.   Foust Donald F.   Dumas William V.  

Journal of Adhesion Science and Technology, Vol. 6, Iss. 11, 1992-01 ,pp. : 1205-1219

Taylor & Francis Ltd

Access to resources Recommend Favorite

Adhesion of electrolessly-deposited copper to photosensitive epoxy

By Ge J.   Tuominen R.   Kivilahti J. K.  

Journal of Adhesion Science and Technology, Vol. 15, Iss. 10, 2001-10 ,pp. : 1133-1143

Taylor & Francis Ltd

Access to resources Recommend Favorite

Adhesion interaction between electrolessly deposited copper film and polyimide

By Vorobyova T.N.  

Journal of Adhesion Science and Technology, Vol. 11, Iss. 2, 1997-01 ,pp. : 167-182

Taylor & Francis Ltd

Access to resources Recommend Favorite

Surface modification of poly(tetrafluoroethylene) films by plasma polymerization and UV-induced graft copolymerization for adhesion enhancement with electrolessly-deposited copper

By Yang G. H.   Kang E. T.   Neoh K. G.  

Journal of Adhesion Science and Technology, Vol. 15, Iss. 6, 2001-06 ,pp. : 727-746

Taylor & Francis Ltd

Access to resources Recommend Favorite

Surface modification of poly(tetrafluoroethylene) films by graft copolymerization for adhesion enhancement with electrolessly deposited copper

By Wu Shaoyu   Kang E. T.   Neoh K. G.  

Journal of Adhesion Science and Technology, Vol. 14, Iss. 11, 2000-09 ,pp. : 1451-1468

Taylor & Francis Ltd

Access to resources Recommend Favorite