Adhesion studies of radio-frequency sputtered SiO2 films on Ti, stainless steel, Ni and Inconel substrates. Effects of substrate surface ion bombardment etching

By Lee G.H.  

Journal of Adhesion Science and Technology, Vol. 4, Iss. 1, 1990-01 ,pp. : 481-501

Taylor & Francis Ltd

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Effects of substrate bias voltage on adhesion of DC magnetron-sputtered copper films on E24 carbon steel: investigations by Auger electron spectroscopy

By Ouis Abousoufiane   Cailler Michel  

Journal of Adhesion Science and Technology, Vol. 27, Iss. 21, 2013-11 ,pp. : 2367-2386

Taylor & Francis Ltd

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Adhesion enhancement of magnetron-sputtered copper films by ion bombardment etching treatment of nickel and Inconel substrates: investigations by Auger electron spectroscopy and secondary ion mass spectroscopy of the ion beam effects

By Cahoreau M.  

Journal of Adhesion Science and Technology, Vol. 5, Iss. 11, 1991-01 ,pp. : 987-999

Taylor & Francis Ltd

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The role of ion-induced substrate damage in thin film adhesion strength

By Cailler M.  

Journal of Adhesion Science and Technology, Vol. 5, Iss. 11, 1991-01 ,pp. : 973-985

Taylor & Francis Ltd

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Adhesion enhancement of thin copper film on polyimide modified by oxygen reactive ion beam etching

By Paik Kyung W.   Ruoff Arthur L.  

Journal of Adhesion Science and Technology, Vol. 4, Iss. 1, 1990-01 ,pp. : 465-474

Taylor & Francis Ltd

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