Development of Flip-chip Joining Technology on Flexible Circuitry Using Anistropically Conductive Adhesives and Eutectic Solder*

Author： Liu J   Boustedt K   Lai Z  

Publisher： Emerald Group Publishing Ltd

ISSN： 0305-6120

Source： Circuit World, Vol.22, Iss.2, 1996-02, pp. : 19-24

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