A low-cost chip size package ‐ NuCSP

Author: Chou T.   Lau J.  

Publisher: Emerald Group Publishing Ltd

ISSN: 0305-6120

Source: Circuit World, Vol.24, Iss.1, 1998-01, pp. : 34-38

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

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Abstract