Engineering solder paste performance through controlled stress rheology analysis

Author: Bao Xiaohua   Lee Ning-Cheng   Raj Rajkumar B   Rangan K.P.   Maria Anu  

Publisher: Emerald Group Publishing Ltd

ISSN: 0954-0911

Source: Soldering & Surface Mount Technology, Vol.10, Iss.2, 1998-02, pp. : 26-35

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Abstract