Period of time: 2015年2期
Publisher: Emerald Group Publishing Ltd
Founded in: 1981
Total resources: 58
ISSN: 0954-0911
Subject: TF Metallurgical Industry
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Soldering & Surface Mount Technology,volume 10,issue 2
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Numerical modelling of solder joint formation
By Bailey Chris,Wheeler Daniel,Cross Mark in (1998)
Soldering & Surface Mount Technology,volume 10,issue 2 , Vol. 10, Iss. 2, 1998-02 , pp.The beneficial effect of underfilling on the reliability of flip-chip joints
Soldering & Surface Mount Technology,volume 10,issue 2 , Vol. 10, Iss. 2, 1998-02 , pp.The criticality of component forming and tinning in a high-reliability low-volume facility
By Cusick David L,Knight William F,Madeiros Bob in (1998)
Soldering & Surface Mount Technology,volume 10,issue 2 , Vol. 10, Iss. 2, 1998-02 , pp.Engineering solder paste performance through controlled stress rheology analysis
By Bao Xiaohua,Lee Ning-Cheng,Raj Rajkumar B,Rangan K.P.,Maria Anu in (1998)
Soldering & Surface Mount Technology,volume 10,issue 2 , Vol. 10, Iss. 2, 1998-02 , pp.Layout designs for robotic PCB assembly
Soldering & Surface Mount Technology,volume 10,issue 2 , Vol. 10, Iss. 2, 1998-02 , pp.